The OSFP 400GBASE-DR4 silicon photonics transceiver is based on a new state-of-the-art silicon photonics (SiPh) platform. It uses SiPh chips that integrate a number of active and passive optoelectronic components. It is a cost-effective and lower power consumption solution for 400GBASE data center.
The 400GBASE-DR4 silicon photonics module supports link lengths of up to 500m SMF with MTP/MPO-12 connector. It is compliant with OSFP MSA, CMIS 4.0 I2C Interface and 400GAUI-8 standards. The 400 Gigabit Ethernet signal is carried over four parallel 1310nm optical lanes by one wavelength per lane. It can be used as 4x100G breakout to QSFP-DR-100G.
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Customized 400G DR4 OSFP PAM4 1310nm 500m DOM MTP/MPO-12 APC SMF Optical Transceiver Module, Support 4× 100G-DR
#192529
#192529
US$1,099.00
FS P/N: OSFP-DR4-400G-SiFS P/N: OSFP-DR4-400G-Si
Заказы 16
Отзыв 0
Вопросы 2
Совместимые бренды:
NVIDIA (Infiniband)
Артикул оборудования:
10 шт. в пути, 04 июн, 2024
Посмотреть больше складов
Страна доставки: Казахстан
US$50.00 по DHL Express Worldwide
Дизайн товара
5 года гарантии
Описание
Решение для применения
Особенности
Вопросы и ответы
Отзывы
Библиотека
Customized 400G DR4 OSFP PAM4 1310nm 500m DOM MTP/MPO-12 Silicon Photonics Transceiver Module (SMF, 1310nm, 500m, MTP/MPO-12, DOM)
Specifications
Part Number
OSFP-DR4-400G-Si
Vendor Name
FS
Form Factor
OSFP
Max Data Rate
425Gbps (4x106.25Gb/s)
Wavelength
1310nm
Max Cable Distance
500m
Connector
MTP/MPO-12 (APC)
Media
SMF
Transmitter Type
DFB
Receiver Type
PIN
TX Power
-2.9~4.0dBm
Receiver Sensitivity
<-5.9dBm
Powerbudget
3dB
Receiver Overload
5dBm
Power Consumption
≤10W
Extinction Ratio
>3.5dB
DDM/DOM
Supported
Commercial Temperature Range
0 to 70°C (32 to 158°F)
CDR (Clock and Data Recovery)
TX and RX
Inbuilt FEC
No
Protocols
IEEE 802.3bs, OSFP MSA, CMIS 4.0
Warranty
5 Years
Quality Testing Program
Quality Testing Program
Optical Transceivers Testing Learn more
Сертификаты качества
Подробную информацию о сертификации см. в разделе Загрузка статуса соответствия товара.
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Обратите внимание: Установка модуля стороннего производителя не аннулирует гарантию на сетевое оборудование. Все производители сетевого оборудования имеют рекомендации, в которых говорится, что гарантийная поддержка их продукции не будет затронута.
Решение для применения
Leaf-spine Connections
400G Connectivity with Direct Connect Cabling
Более
Leaf-spine Connections
Посмотреть товары 400G Connectivity with Direct Connect Cabling
Посмотреть товары 100G to 400G Migration
Посмотреть товары 400G Structured Cabling Connections
Посмотреть товары Особенности
SiPh-Based High-performance Chip Designed for Data Center
Increase network uptime with silicon photonics that reduces cost of ownership.
Broadcom 7nm DSP Chip
Stable Transmission
≤10W
Low Power Consumption
400Gbps
High Bandwidth
SiPh-Based High-performance Chip Designed for Data Center
Increase network uptime with silicon photonics that reduces cost of ownership.
Broadcom 7nm DSP Chip
Stable Transmission
≤10W
Low Power Consumption
400Gbps
High Bandwidth
Center Wavelength | 1310nm | 1310nm | 1310nm |
Connector | MTP/MPO-8 MTP/MPO-12(8 of the 12 Fibers Used) | MTP/MPO-8 MTP/MPO-12(8 of the 12 Fibers Used) | MTP/MPO-8 MTP/MPO-12(8 of the 12 Fibers Used) |
Cable Distance (Max.) | 500m@SMF | 500m@SMF | 500m@SMF |
Modulation | 8x 50G PAM4 | 8x 50G PAM4 | 4x 106.25G PAM4 |
DSP | Broadcom 7nm DSP | Broadcom 7nm DSP | Macom Chip |
Transmitter Type | DFB | DFB | EML |
Protocols | OSFP MSA, CMIS 4.0, IEEE 802.3bs | QSFP-DD MSA, CMIS Rev4.1, OIF 56G PAM4, 100G Lambda MSA, IEEE 802.3bs | QSFP112 MSA, CMIS 5.0, IEEE Std 802.3ck, IEEE 802.3bs |
Application | Data Center 800G to 2x400G Breakout 400G to 4x100G Breakout | Data Center 800G to 2x400G Breakout 400G to 4x100G Breakout | Data Center |
Описание
Customized 400G DR4 OSFP PAM4 1310nm 500m DOM MTP/MPO-12 Silicon Photonics Transceiver Module (SMF, 1310nm, 500m, MTP/MPO-12, DOM)
The OSFP 400GBASE-DR4 silicon photonics transceiver is based on a new state-of-the-art silicon photonics (SiPh) platform. It uses SiPh chips that integrate a number of active and passive optoelectronic components. It is a cost-effective and lower power consumption solution for 400GBASE data center.
The 400GBASE-DR4 silicon photonics module supports link lengths of up to 500m SMF with MTP/MPO-12 connector. It is compliant with OSFP MSA, CMIS 4.0 I2C Interface and 400GAUI-8 standards. The 400 Gigabit Ethernet signal is carried over four parallel 1310nm optical lanes by one wavelength per lane. It can be used as 4x100G breakout to QSFP-DR-100G.
Specifications
Part Number
OSFP-DR4-400G-Si
Vendor Name
FS
Form Factor
OSFP
Max Data Rate
425Gbps (4x106.25Gb/s)
Wavelength
1310nm
Max Cable Distance
500m
Connector
MTP/MPO-12 (APC)
Media
SMF
Transmitter Type
DFB
Receiver Type
PIN
TX Power
-2.9~4.0dBm
Receiver Sensitivity
<-5.9dBm
Powerbudget
3dB
Receiver Overload
5dBm
Power Consumption
≤10W
Extinction Ratio
>3.5dB
DDM/DOM
Supported
Commercial Temperature Range
0 to 70°C (32 to 158°F)
CDR (Clock and Data Recovery)
TX and RX
Inbuilt FEC
No
Protocols
IEEE 802.3bs, OSFP MSA, CMIS 4.0
Warranty
5 Years
Quality Testing Program
Quality Testing Program
Optical Transceivers Testing Learn more
Сертификаты качества
Подробную информацию о сертификации см. в разделе Загрузка статуса соответствия товара.
Обратите внимание: Установка модуля стороннего производителя не аннулирует гарантию на сетевое оборудование. Все производители сетевого оборудования имеют рекомендации, в которых говорится, что гарантийная поддержка их продукции не будет затронута.
Решение для применения
Leaf-spine Connections
400G Connectivity with Direct Connect Cabling
Более
Leaf-spine Connections
Посмотреть товары 400G Connectivity with Direct Connect Cabling
Посмотреть товары 100G to 400G Migration
Посмотреть товары 400G Structured Cabling Connections
Посмотреть товары Особенности
SiPh-Based High-performance Chip Designed for Data Center
Increase network uptime with silicon photonics that reduces cost of ownership.
Broadcom 7nm DSP Chip
Stable Transmission
≤10W
Low Power Consumption
400Gbps
High Bandwidth
SiPh-Based High-performance Chip Designed for Data Center
Increase network uptime with silicon photonics that reduces cost of ownership.
Broadcom 7nm DSP Chip
Stable Transmission
≤10W
Low Power Consumption
400Gbps
High Bandwidth
Center Wavelength | 1310nm | 1310nm | 1310nm |
Connector | MTP/MPO-8 MTP/MPO-12(8 of the 12 Fibers Used) | MTP/MPO-8 MTP/MPO-12(8 of the 12 Fibers Used) | MTP/MPO-8 MTP/MPO-12(8 of the 12 Fibers Used) |
Cable Distance (Max.) | 500m@SMF | 500m@SMF | 500m@SMF |
Modulation | 8x 50G PAM4 | 8x 50G PAM4 | 4x 106.25G PAM4 |
DSP | Broadcom 7nm DSP | Broadcom 7nm DSP | Macom Chip |
Transmitter Type | DFB | DFB | EML |
Protocols | OSFP MSA, CMIS 4.0, IEEE 802.3bs | QSFP-DD MSA, CMIS Rev4.1, OIF 56G PAM4, 100G Lambda MSA, IEEE 802.3bs | QSFP112 MSA, CMIS 5.0, IEEE Std 802.3ck, IEEE 802.3bs |
Application | Data Center 800G to 2x400G Breakout 400G to 4x100G Breakout | Data Center 800G to 2x400G Breakout 400G to 4x100G Breakout | Data Center |
Вопросы и ответы
Отзывы
Библиотека
US$1,099.00
10 шт. в пути