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Kostenloser Versand bei Bestellung über 79 € (exkl. MwSt.)
 Dieses Bild handelt von OSFP-DR4-400G-Si.
 Dieses Bild handelt von OSFP-DR4-400G-Si.
 Dieses Bild handelt von OSFP-DR4-400G-Si.
 Dieses Bild handelt von OSFP-DR4-400G-Si.
 Dieses Bild handelt von OSFP-DR4-400G-Si.
 Dieses Bild handelt von OSFP-DR4-400G-Si.
 Dieses Bild handelt von OSFP-DR4-400G-Si.
 Dieses Bild handelt von OSFP-DR4-400G-Si.
 Dieses Bild handelt von OSFP-DR4-400G-Si.
 Dieses Bild handelt von OSFP-DR4-400G-Si.

Customized 400G DR4 OSFP PAM4 1310nm 500m DOM MTP/MPO-12 APC SMF Optical Transceiver Module, Support 4× 100G-DR

#192529
#192529

Broadcom 7nm DSP Broadcom DFB SiPh-Based < 10W MTP-12 SMF 4x 100G-DR

1.098,00 € (exkl. MwSt.)
FS P/N: OSFP-DR4-400G-Si
1.306,62 € (inkl. MwSt.)
FS P/N: OSFP-DR4-400G-Si
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Lösungsdesign
5-Jahres-Garantie
Spezifikationen
Anwendungslösung
Merkmale
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Ressourcen

Customized 400G DR4 OSFP PAM4 1310nm 500m DOM MTP/MPO-12 Silicon Photonics Transceiver Module (SMF, 1310nm, 500m, MTP/MPO-12, DOM)

The OSFP 400GBASE-DR4 silicon photonics transceiver is based on a new state-of-the-art silicon photonics (SiPh) platform. It uses SiPh chips that integrate a number of active and passive optoelectronic components. It is a cost-effective and lower power consumption solution for 400GBASE data center.
The 400GBASE-DR4 silicon photonics module supports link lengths of up to 500m SMF with MTP/MPO-12 connector. It is compliant with OSFP MSA, CMIS 4.0 I2C Interface and 400GAUI-8 standards. The 400 Gigabit Ethernet signal is carried over four parallel 1310nm optical lanes by one wavelength per lane. It can be used as 4x100G breakout to QSFP-DR-100G.

Specifications
Part Number
OSFP-DR4-400G-Si
Vendor Name
FS
Form Factor
OSFP
Max Data Rate
425Gbps (4x106.25Gb/s)
Wavelength
1310nm
Max Cable Distance
500m
Connector
MTP/MPO-12 (APC)
Media
SMF
Transmitter Type
DFB
Receiver Type
PIN
TX Power
-2.9~4.0dBm
Receiver Sensitivity
<-5.9dBm
Powerbudget
3dB
Receiver Overload
5dBm
Power Consumption
≤10W
Extinction Ratio
>3.5dB
DDM/DOM
Supported
Commercial Temperature Range
0 to 70°C (32 to 158°F)
CDR (Clock and Data Recovery)
TX and RX
Inbuilt FEC
No
Protocols
IEEE 802.3bs, OSFP MSA, CMIS 4.0
Warranty
5 Years

Quality Testing Program

Take a look at our test program to get the reliable and high-performance optical transceivers.

Quality Testing Program

Optical Transceivers Testing Learn more
Qualitätszertifizierungen
Die ausführliche Zertifizierung finden Sie unter Konformitätsstatus des Produkts zum Herunterladen.
Bitte beachten Sie: Die Installation eines Drittanbieter-Transceivers erlischt Ihre Netzausrüstungsgarantie nicht. Netzwerkausrüstungshersteller haben alle Richtlinien, die erklären, daß Garantieunterstützung auf ihren Produkten nicht beeinflußt wird.

Anwendungslösung

Leaf-spine Connections
Mehr
Leaf-spine Connections
Produkte anzeigen
400G-Konnektivität mit Direktverbindungsverkabelung
Produkte anzeigen
100G to 400G Migration
Produkte anzeigen
400G Structured Cabling Connections
Produkte anzeigen

Merkmale

SiPh-Based High-performance Chip Designed for Data Center
Increase network uptime with silicon photonics that reduces cost of ownership.
Broadcom 7nm DSP Chip
Stable Transmission
≤10W
Low Power Consumption
400Gbps
High Bandwidth
SiPh-Based High-performance Chip Designed for Data Center
Increase network uptime with silicon photonics that reduces cost of ownership.
Broadcom 7nm DSP Chip
Stable Transmission
≤10W
Low Power Consumption
400Gbps
High Bandwidth
Center Wavelength
1310nm
1310nm
1310nm
Connector
MTP/MPO-8
MTP/MPO-12(8 of the 12 Fibers Used)
MTP/MPO-8
MTP/MPO-12(8 of the 12 Fibers Used)
MTP/MPO-8
MTP/MPO-12(8 of the 12 Fibers Used)
Cable Distance (Max.)
500m@SMF
500m@SMF
500m@SMF
Modulation
8x 50G PAM4
8x 50G PAM4
4x 106.25G PAM4
DSP
Broadcom 7nm DSP
Broadcom 7nm DSP
Macom Chip
Transmitter Type
DFB
DFB
EML
Protocols
OSFP MSA, CMIS 4.0, IEEE 802.3bs
QSFP-DD MSA, CMIS Rev4.1, OIF 56G PAM4, 100G Lambda MSA, IEEE 802.3bs
QSFP112 MSA, CMIS 5.0, IEEE Std 802.3ck, IEEE 802.3bs
Application
Data Center
800G to 2x400G Breakout
400G to 4x100G Breakout
Data Center
800G to 2x400G Breakout
400G to 4x100G Breakout
Data Center
Spezifikationen

Customized 400G DR4 OSFP PAM4 1310nm 500m DOM MTP/MPO-12 Silicon Photonics Transceiver Module (SMF, 1310nm, 500m, MTP/MPO-12, DOM)

The OSFP 400GBASE-DR4 silicon photonics transceiver is based on a new state-of-the-art silicon photonics (SiPh) platform. It uses SiPh chips that integrate a number of active and passive optoelectronic components. It is a cost-effective and lower power consumption solution for 400GBASE data center.
The 400GBASE-DR4 silicon photonics module supports link lengths of up to 500m SMF with MTP/MPO-12 connector. It is compliant with OSFP MSA, CMIS 4.0 I2C Interface and 400GAUI-8 standards. The 400 Gigabit Ethernet signal is carried over four parallel 1310nm optical lanes by one wavelength per lane. It can be used as 4x100G breakout to QSFP-DR-100G.

Specifications
Part Number
OSFP-DR4-400G-Si
Vendor Name
FS
Form Factor
OSFP
Max Data Rate
425Gbps (4x106.25Gb/s)
Wavelength
1310nm
Max Cable Distance
500m
Connector
MTP/MPO-12 (APC)
Media
SMF
Transmitter Type
DFB
Receiver Type
PIN
TX Power
-2.9~4.0dBm
Receiver Sensitivity
<-5.9dBm
Powerbudget
3dB
Receiver Overload
5dBm
Power Consumption
≤10W
Extinction Ratio
>3.5dB
DDM/DOM
Supported
Commercial Temperature Range
0 to 70°C (32 to 158°F)
CDR (Clock and Data Recovery)
TX and RX
Inbuilt FEC
No
Protocols
IEEE 802.3bs, OSFP MSA, CMIS 4.0
Warranty
5 Years

Quality Testing Program

Take a look at our test program to get the reliable and high-performance optical transceivers.

Quality Testing Program

Optical Transceivers Testing Learn more
Qualitätszertifizierungen
Die ausführliche Zertifizierung finden Sie unter Konformitätsstatus des Produkts zum Herunterladen.
Bitte beachten Sie: Die Installation eines Drittanbieter-Transceivers erlischt Ihre Netzausrüstungsgarantie nicht. Netzwerkausrüstungshersteller haben alle Richtlinien, die erklären, daß Garantieunterstützung auf ihren Produkten nicht beeinflußt wird.
Anwendungslösung
Leaf-spine Connections
Mehr
Leaf-spine Connections
Produkte anzeigen
400G-Konnektivität mit Direktverbindungsverkabelung
Produkte anzeigen
100G to 400G Migration
Produkte anzeigen
400G Structured Cabling Connections
Produkte anzeigen
Merkmale
SiPh-Based High-performance Chip Designed for Data Center
Increase network uptime with silicon photonics that reduces cost of ownership.
Broadcom 7nm DSP Chip
Stable Transmission
≤10W
Low Power Consumption
400Gbps
High Bandwidth
SiPh-Based High-performance Chip Designed for Data Center
Increase network uptime with silicon photonics that reduces cost of ownership.
Broadcom 7nm DSP Chip
Stable Transmission
≤10W
Low Power Consumption
400Gbps
High Bandwidth
Center Wavelength
1310nm
1310nm
1310nm
Connector
MTP/MPO-8
MTP/MPO-12(8 of the 12 Fibers Used)
MTP/MPO-8
MTP/MPO-12(8 of the 12 Fibers Used)
MTP/MPO-8
MTP/MPO-12(8 of the 12 Fibers Used)
Cable Distance (Max.)
500m@SMF
500m@SMF
500m@SMF
Modulation
8x 50G PAM4
8x 50G PAM4
4x 106.25G PAM4
DSP
Broadcom 7nm DSP
Broadcom 7nm DSP
Macom Chip
Transmitter Type
DFB
DFB
EML
Protocols
OSFP MSA, CMIS 4.0, IEEE 802.3bs
QSFP-DD MSA, CMIS Rev4.1, OIF 56G PAM4, 100G Lambda MSA, IEEE 802.3bs
QSFP112 MSA, CMIS 5.0, IEEE Std 802.3ck, IEEE 802.3bs
Application
Data Center
800G to 2x400G Breakout
400G to 4x100G Breakout
Data Center
800G to 2x400G Breakout
400G to 4x100G Breakout
Data Center

Fragen & Antworten

Bewertungen

Ressourcen

1.098,00 € (exkl. MwSt.)

1.306,62 € (inkl. MwSt.)

10 im Transit