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Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 19W
Self-developed 53G EML Laser Chip to Ensure Production
Parameter Tests for Superior Performance, Quality, and Reliability
High-speed Connectivity Compliant to IEEE 802.3ck and IEEE 802.3cu-2021
Connect New 800G Sites to Legacy 400G Sites via 2x400G Breakout
Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 18W
Self-developed 53G EML Laser Chip to Ensure Production
Parameter Tests for Superior Performance, Quality, and Reliability
Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 17W
Self-developed 53G EML Laser Chip to Ensure Production
Parameter Tests for Superior Performance, Quality, and Reliability
High-speed Connectivity Compliant to IEEE 802.3ck and IEEE 802.3cu-2021
Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 16.5W
Parameter Tests for Superior Performance, Quality, and Reliability
High-speed Connectivity Compliant to IEEE 802.3ck and IEEE 802.3cu
Hot Pluggable OSFP MSA Compliant
Connect New 800G Sites to Legacy 400G Sites via 2x400G Breakout
Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 16.5W
Self-developed 53G EML Laser Chip to Ensure Production
Parameter Tests for Superior Performance, Quality, and Reliability
Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 18W
Parameter Tests for Superior Performance, Quality, and Reliability
High-speed Connectivity Compliant to IEEE 802.3ck and IEEE 802.3cu
Hot Pluggable QSFP-DD MSA Compliant
Connect New 800G Sites to Legacy 400G Sites via 2x400G Breakout
Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 16W
Self-developed 53G EML Laser Chip to Ensure Production
Parameter Tests for Superior Performance, Quality, and Reliability
Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 18W
Self-developed 53G EML Laser Chip to Ensure Production
Parameter Tests for Superior Performance, Quality, and Reliability
High-speed Connectivity Compliant to IEEE 802.3ck
Built-in Broadcom 7nm DSP Chip, Typical Power Consumption 16.5W
Parameter Tests for Superior Performance, Quality, and Reliability
High-speed Connectivity Compliant to IEEE 802.3ck and IEEE 802.3cu-2021
Hot Pluggable OSFP MSA Compliant
Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 16.5W
Parameter Tests for Superior Performance, Quality, and Reliability
High-speed Connectivity Compliant to IEEE 802.3ck and IEEE 802.3cu-2021
Hot Pluggable OSFP MSA Compliant
Built-in Broadcom 7nm DSP Chip, Typical Power Consumption 18W
Parameter Tests for Superior Performance, Quality, and Reliability
High-speed Connectivity Compliant to CMIS Rev 5.0 and IEEE 802.3cu-2021
Hot Pluggable QSFP-DD MSA Compliant
Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 16.5W
Parameter Tests for Superior Performance, Quality, and Reliability
High-speed Connectivity Compliant to IEEE 802.3ck and IEEE 802.3cu-2021
Hot Pluggable OSFP MSA Compliant
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