The 800GBASE-SR8 QSFP-DD Optical Transceiver Module supports up to 50m link lengths over multi-mode fiber (MMF) via MTP/MPO-16 connectors. This transceiver is compliant with IEE802.3ck, CMIS 5.0 and QSFP-DD MSA standards. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parameters. It is suitable for 800G Ethernet.
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H3C QSFPDD-800G-VR8-MM850-DMPO Compatible QSFP-DD 800GBASE-SR8 PAM4 850nm 50m DOM MPO-16/APC MMF Optical Transceiver Module
#230063
#230063
US$1,399.00
FS P/N: QDD-SR8-800GFS P/N: QDD-SR8-800G
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Transceiver Models:
Pre-order, Ship by 27 Nov, 2024
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Deliver to New York, 10010
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5-Year Warranty
30-Day Returns
30-Day Exchange
H3C QSFPDD-800G-VR8-MM850-DMPO Compatible 800GBASE-SR8 QSFP-DD Optical Transceiver Module (MMF, 850nm, 50m, MTP/MPO-16, DOM)
Specifications
H3C Compatible
QSFPDD-800G-VR8-MM850-DMPO
Vendor Name
FS
Form Factor
QSFP-DD
Max Data Rate
850Gbps (8x 106.25Gbps)
Wavelength
850nm
Max Cable Distance
30m@OM3/50m@OM4
Connector
MTP/MPO-16 APC
Cable Type
MMF
Transmitter Type
VCSEL
Receiver Type
PIN
TX Power
-4.6-4dBm
Minimum Receiver Power
-6.4dBm
Power Budget
2dB
Receiver Overload
4dBm
Power Consumption
≤13W
Extinction Ratio
＞2.5dB
Modulation (Electrical)
8x106.25Gb/s PAM
Modulation (Optical)
8x106.25Gb/s PAM4
Packaging Technology
COB (Chip on Board) Packaging
Modulation Format
PAM4
CDR (Clock and Data Recovery)
TX and RX Built-in DSP
Inbuilt FEC
Yes
Protocols
IEEE 802.3ck-2022, CMIS 5.0
Warranty
5 Years
Quality Certifications
To get the detailed certification, please go to the Compliance Center.
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Please Note: Installing a third party transceiver does not void your network equipment warranty. Network equipment manufacturers all have guidelines stating that warranty support on their products will not be affected.
Connectivity Solutions
Features
Leading Performance and Quality for 800G
Built-in Broadcom DSP Chip, the QSFP-DD transceiver offers higgh-speed and low-power in 800G links.
Broadcom 7nm DSP Chip
Stable Transmission
≤13W
Low Power Consumption
VCSEL Laser
Ensure Production
Center Wavelength | 850nm | 1310nm | 1310nm | 1311nm |
Connector | MTP/MPO-16 | MTP/MPO-16 | MTP/MPO-16 | MTP/MPO-16 |
Cable Distance (Max.) | 30m@OM3/50m@OM4 | 500m@SMF | 2km | 10km |
Modulation | 8x106.25G PAM4 | 8x106.25G PAM4 | 8x106.25G PAM4 | 8x106.25G PAM4 |
Transmitter Type | VCSEL | EML | EML | EML |
Packaging Technology | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging |
Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip |
Power Consumption | ≤13W | ≤16.5W | ≤18W | ≤18W |
Application | Ethernet Data Center | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout |
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