AmpCon-Campus Simplifying Campus Fabric from MLAG to IP Clos
Streamline campus networks from MLAG to IP Clos with AmpCon-Campus. Deploy faster, ensure reliability, and explore our solutions today!

What Is PicOS-V and How to Use It?

FS AmpCon: Enhancing Efficiency in Data Center and Campus Management

FS and Supermicro Enhance Collaboration for HPC and Data Center Solutions on Advanced Servers

FS and Siemens Collaborate to Implement an Automated Switch Loading Test Production Line

FS and US Conec Announce Expanded Collaboration in High Density Interconnect Solutions

Streamline campus networks from MLAG to IP Clos with AmpCon-Campus. Deploy faster, ensure reliability, and explore our solutions today!

This article explores how to simplify and optimize InfiniBand network management through FS PicOS® software and AmpCon™ management platform.

Discover how NVIDIA H100 GPU and FS InfiniBand solutions transform AI & HPC data centers with unmatched performance, scalability, and reliability.

本文探讨了单模光纤用于数据中心布线优势,包括其能够实现长距离传输、在狭小空间内提供更优的弯曲半径并确保持续低损耗等特性。采用OS2单模光纤,升级您的光纤数据中心。

深入了解OS2光纤的方方面面,包括其应用、兼容性和定制选项。获取有关光纤类型的常见问题解答,并深入了解FS的丰富产品线。通过我们全面的常见问题解答,加深您对单模光缆的理解。

Meet FS's first serial-to-fiber converters, extending reliable serial communication over fiber for industrial control and long-distance deployments.

Discover the risks of outdated infrastructure and key signals for LAN upgrades. Learn how to prepare your enterprise network for Wi-Fi 7 and long-term scalability.

Learn how to design practical, scalable networks for NVIDIA DGX Spark deployments. Explore reference architectures, workload considerations, and how FS’s network solution ensures predictable performance, low latency, and easy deployment for enterprise AI workloads.

Cut costs and boost speeds with FS Lightweight GPON. The 4-port OLT & 2.5G ONU solution maximizes ROI for ISPs.

Maximize NVIDIA DGX Spark performance with FS 200G/400G DAC solutions. Explore FS Ethernet interconnects for dual-node stacks and multi-node DGX Spark clusters.

Meet FS 800G AI switches powered by Broadcom Tomahawk 5 chip, delivering 51.2 Tbps switching capacity, ultra-low latency, and high-density 800GbE connectivity to build scalable, lossless AI data center networks.

Explore FS PicOS® 400G AI switches powered by Broadcom Tomahawk 3 & 4 chips. Get high bandwidth, ultra-low latency, and lossless Ethernet to unlock full AI cluster performance.