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This picture is about X710BM2-2SN.
This picture is about X710BM2-2SN.
This picture is about X710BM2-2SN.
This picture is about X710BM2-2SN.
This picture is about X710BM2-2SN.
This picture is about X710BM2-2SN.
This picture is about X710BM2-2SN.
This picture is about X710BM2-2SN.
This picture is about X710BM2-2SN.
This picture is about X710BM2-2SN.
P/N:X710BM2-2SN
SKU:327365
AUD335.50
GST Incl.

Product Highlights

OCP NIC 3.0 Accommodates High-Density Deployments to Improve Interoperability and Compatibility for Seamless Integration
Low Power Intel X710-BM2 Adapts to High-Density Green Data Center Needs
Supports Geneve, VXLAN, and NVGRE for High Throughput and Lower CPU Usage
Data Plane Development Kit (DPDK) Optimised for Efficient Packet Processing
Excellent Small Packet Performance for Network Appliances and Network Functions Virtualization

Intel X710-BM2 Based Ethernet Network Interface Card, 10G Dual-Port SFP+, OCP 3.0, PCIe 3.0 x 8, Comparable to Intel X710-DA2 OCP 3.0, Thumbscrew (Pull-tab) Bracket

The Intel® Ethernet 700 Series delivers networking performance across a wide range of network port speeds through intelligent offloads, sophisticated packet processing, and quality open source drivers. With two 10GbE SFP+ ports and key performance optimisations, the X710BM2 for OCP 3.0 supports Cloud, Enterprise, and Communications solutions.
The OCP NIC 3.0 specification defines a standardised design for a new generation of network adapters. Simple and straightforward form factors, clear manageability requirements, and improved serviceability help simplify deployment for current and emerging capabilities.

Product Spotlights

Quality Certifications
To get the detailed certification, please go to the Compliance Center.
Connectivity Solutions
Features
Efficient Data Center Networking Solution Based on Intel NICs
OCP NIC 3.0 Enables Compact Servers for High-Power NICs

OCP NIC 3.0, with simple form factors, clear manageability, and improved serviceability, integrates Intel X710 chips to cut power use, simplifying deployment for current/emerging capabilities.

Advanced Networking and Security

Intel X710 supports SR-IOV, Intel® Data Direct I/O Technology, and protocols like Geneve and VXLAN, optimising performance, offloading cloud network workloads, freeing CPU cores, enhancing security, and lowering TCO.

Unlock Seamless Network Performance with Compatibility Testing

The universal interface seamlessly integrates with mainstream server motherboards and supports multiple operating systems, reducing costs while safeguarding investment flexibility and future scalability.

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X710BM2-2SN
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X710BM2-2SP
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82599ES-2SP
Controller
Intel X710-BM2
Intel X710-BM2
Intel 82599ES
Bracket Height
OCP 3.0
Full Height and Low Profile
Full Height and Low Profile
Supported Ethernet Speeds
10/1GbE
10/1GbE
10/1GbE
Ports
Dual
Dual
Dual
Systems Interface Type
PCIe 3.0x 8 (8.0 GT/s)
PCIe 3.0x 8 (8.0 GT/s)
PCIe 2.0x 8 (5.0 GT/s)
SR-IOV

Yes

Yes

Yes

FCoE
-
-

Yes

VMDq

Yes

Yes

Yes

DPDK

Yes

Yes

Yes

NVGER

Yes

Yes

-
GENEVE

Yes

Yes

-
VXLAN

Yes

Yes

-
IWARP
-
-
-
RoCE
-
-
-
Connectivity (VT-c)
Yes
Yes
Yes
Card PCB Dimensions (WxD)
4.59"x2.99" (116.61x76mm) with bracket
5.91"x2.68" (150x68mm) without bracket
13.99"x6.84" (139.99x68.45mm) without bracket
Controller
Intel X710-BM2
Intel X710-BM2
Intel 82599ES
Bracket Height
OCP 3.0
Full Height and Low Profile
Full Height and Low Profile
Supported Ethernet Speeds
10/1GbE
10/1GbE
10/1GbE
Ports
Dual
Dual
Dual
Systems Interface Type
PCIe 3.0x 8 (8.0 GT/s)
PCIe 3.0x 8 (8.0 GT/s)
PCIe 2.0x 8 (5.0 GT/s)
SR-IOV

Yes

Yes

Yes

FCoE
-
-

Yes

VMDq

Yes

Yes

Yes

DPDK

Yes

Yes

Yes

NVGER

Yes

Yes

-
GENEVE

Yes

Yes

-
VXLAN

Yes

Yes

-
IWARP
-
-
-
RoCE
-
-
-
Connectivity (VT-c)
Yes
Yes
Yes
Card PCB Dimensions (WxD)
4.59"x2.99" (116.61x76mm) with bracket
5.91"x2.68" (150x68mm) without bracket
13.99"x6.84" (139.99x68.45mm) without bracket
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