The Generic Compatible QSFP-DD transceiver supports up to 10km link lengths over single-mode fiber (SMF) with MTP/MPO-16 connectors. This transceiver is compliant with QSFP-DD MSA HW Rev 6.01, IEEE 802.3cu-2021 and CMIS Rev 5.0 standards. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parameters. It is suitable for 800G Ethernet, Data Center, Breakout 2x 400G PLR4 or 8x 100G LR application.
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Generic Compatible QSFP-DD 800GBASE-PLR8 PAM4 1310nm 10km DOM MPO-16/APC SMF Optical Transceiver Module, Support 2 x 400G-PLR4 and 8 x 100G-LR
800GBASE-PLR8 QSFP-DD Optical Transceiver Module (SMF, 1310nm, 10km, MTP/MPO-16, DOM)
Connectivity Solutions
Features
Center Wavelength | 1311nm | 1311nm | 1310nm | 1271nm, 1291nm, 1311nm and 1331nm |
Connector | MTP/MPO-16 | MTP/MPO-16 | Dual MTP/MPO-12 | Dual LC Duplex |
Cable Distance (Max.) | 10km | 10km | 10km | 10km |
Modulation | 8x106.25G PAM4 | 8x106.25G PAM4 | 8x106.25G PAM4 | 8x106.25G PAM4 |
Transmitter Type | EML | EML | EML | EML |
Packaging Technology | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging |
Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip |
Power Consumption | ≤18W | ≤16.5W | ≤16.5W | ≤18W |
Application | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G |
800GBASE-PLR8 QSFP-DD Optical Transceiver Module (SMF, 1310nm, 10km, MTP/MPO-16, DOM)
The Generic Compatible QSFP-DD transceiver supports up to 10km link lengths over single-mode fiber (SMF) with MTP/MPO-16 connectors. This transceiver is compliant with QSFP-DD MSA HW Rev 6.01, IEEE 802.3cu-2021 and CMIS Rev 5.0 standards. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parameters. It is suitable for 800G Ethernet, Data Center, Breakout 2x 400G PLR4 or 8x 100G LR application.
Center Wavelength | 1311nm | 1311nm | 1310nm | 1271nm, 1291nm, 1311nm and 1331nm |
Connector | MTP/MPO-16 | MTP/MPO-16 | Dual MTP/MPO-12 | Dual LC Duplex |
Cable Distance (Max.) | 10km | 10km | 10km | 10km |
Modulation | 8x106.25G PAM4 | 8x106.25G PAM4 | 8x106.25G PAM4 | 8x106.25G PAM4 |
Transmitter Type | EML | EML | EML | EML |
Packaging Technology | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging |
Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip | Broadcom 7nm DSP Chip |
Power Consumption | ≤18W | ≤16.5W | ≤16.5W | ≤18W |
Application | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G |
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£2,344.00 exc. VAT
£2,812.80 inc. VAT